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Technical Specifications - PCB
Product types: Single sided, double sided (non PTH), plated through hole, multi layers (up to 16 layers).
Board thickness: 0.018" (0.45mm) min, 0.128" (3.2mm) max.
Hole sizes: 0.020" (0.30mm) finished min.
Hole alignment: To centre of pad up to 0.006" (0.15mm).
Plated hole tolerance: +/- 0.004" (0.10mm) standard.
Aspect ratio: 5.3:1.
Annular ring: Drill size +0.010" (0.25mm) minimum.
SMT pitch: 0.020" (0.5mm) minimum.
Conductor width: 0.006" (0.152mm) minimum.
  Conductor spacing:   0.006" (0.152mm) minimum.  
Finishes: Photo imageable curtain coated, peelable solder resist, carbon ink, hot air solder level,
gold over edge connector, electroless nickel/gold, immersion silver.
Solder resist alignment: To centre of pad up to 0.006" (0.15mm).
Scoring tolerance: +/- 0.008" (0.20mm).
Profile tolerance: +/- 0.008" (0.20mm).
Bare board test: Double sided surface mount.
Front end: Full data processing including DRC, in-house photo-plotting,
we prefer data supplied in Gerber format.
Technical Specifications - Plant
Natgraph exposure machines.
Wring ovens.
Mass curtain coater lines.
Morton exposure machines.
Nubal graphole lines.
JWA quick score machines.
Olivetti/Techost bare board testers.
Emma flying probe tester.
Excellon Uniline 2000 auto loader drills.
Excellon XL3's.
Excellon X200's.
Excellon X300s.
LENZ routers.
Gerber Scientific CAM systems.
Mivatec photo plotters.
George Moore multilayer presses.
Cemco (Quicksilver) hot air solder level.